---
schema_version: '1.0'
id: news-20260721-4ec6a4
url: https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC140BY0U6A710C2000000
url_hash: 4ec6a4dd4ed41f4155de21456fa31d32f2466bd5c7f481c4c5ceebc63f2736a8
canonical_url: https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC140BY0U6A710C2000000
source: bing
category: news/science
category_raw: science
region: JP
tags:
- science
- 日本経済新聞
lang: ja
published_at: '2026-07-21T07:59:00Z'
fetched_at: '2026-07-21T20:45:52.055167Z'
updated_at: '2026-07-21T20:46:22Z'
status: published
content_hash: null
content_changed_at: null
license_note: link-only
summary: null
summary_source: null
summary_en: null
entities:
- name: Science
  type: concept
- name: 日本経済新聞
  type: content
key_facts: []
related: []
related_auto:
- name: スペースX
  type: organization
  weight: 1.0
- name: ダイナブック
  type: organization
  weight: 1.0
- name: ディスコ
  type: organization
  weight: 1.0
- name: 射撃訓練
  type: event
  weight: 1.0
- name: 日経平均株価
  type: content
  weight: 1.0
title: 東京科学大、湿度変化に強い絶縁材 6G基板やAI半導体へ
---

# 東京科学大、湿度変化に強い絶縁材 6G基板やAI半導体へ

## TL;DR
（要約なし・原文はリンク先を参照 / No summary available; see the source link.）

## Key Points
- science / 日本経済新聞

## Details
(本文なし。リンク先参照)

## Source
元記事: [東京科学大、湿度変化に強い絶縁材 6G基板やAI半導体へ](https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC140BY0U6A710C2000000) — published 2026-07-21T07:59:00Z